Senior/Staff Process Engineer (Wafer Dicing & Back-grind)

From the original posting

Singapore Core Responsibilities - Responsible for silicon photonic wafer backside grinding/thinning process, laser stealth dicing process and die sorting development for silicon photonic chips, with OSAT or internal line. - Optimize wafer thinning thickness, grinding speed, cutting path and laser cutting parameters to avoid chip crack, edge chipping and optical structure damage of silicon photonic wafers. - Solve process abnormalities in wafer thinning and dicing processes, including wafer warpage, surface scratch, incomplete cutting and chip breakage. - Monitor wafer thickness uniformity,…