Senior/ Staff NPI Wafer Bumping/Fan-Out Process Engineer

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Singapore CORE RESPONSIBILITIES - Lead the process development and technical support of the wafer bumping, and/or Fan-Out process for silicon photonic chip wafers - Process Pathfinding & Integration: Design and optimize early-stage process flows for wafer bumping, thin-film sputtering, lithography, electroplating, and ball drop execution. DOE to characterize process window and margin. - Material Characterization & Selection: Evaluate and qualify new manufacturing raw materials, including dielectric photoresists, plating chemistries, underfills, and solder alloys. - Reliability & Stress…