Senior/Staff Process Engineer (Flip Chip)

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Singapore Core Responsibilities 1. Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow. 2. DOE to characterize process window and margin. Optimize process integration with upstream processes (e.g. bump/FO) to increase yield and manufacturability. 3. Material Characterization & Selection: Evaluate and qualify new manufacturing raw materials, including NCP, flux, underfill etc, as…